As the requirements for lighter, thinner and more efficient terminal products increase, the development direction of semiconductor solutions is not only to improve performance, heat generation and heat dissipation performance have also become very important factors in semiconductor design. The heat generation is mainly related to the chip manufacturing process and the temperature control algorithm, and the heat dissipation performance can be worked hard on the material and product structure.
Here I want to introduce to you the use of chemical vapor, phase deposition (CVD) diamond, as a new advanced thermal management solution, it is especially suitable for RF power amplifiers. The CVD diamond heat sink has been proven to reduce the overall package thermal resistance, and its performance far exceeds other commonly used materials. How is CVD diamond better than traditional heat dissipation materials?
As a direct relative of diamonds, diamonds with "carbon element" characteristics are not small, including the highest known thermal conductivity, stiffness and hardness ,and at the same time have high optical transmission characteristics, low expansion coefficient and low density in a large wavelength range. Attributes. These characteristics make diamond a material for thermal management applications that can significantly reduce thermal resistance.
To synthesize diamonds for thermal management applications, the first step is to select the most appropriate deposition technology. Microwave-assisted CVD can better control the grain size and grain interface, so as to produce high-quality and reproducible polycrystalline diamond that meets the thermal conductivity level of specific applications. At present, CVD diamond has been commercialized, and there are 1000-2000 W/m.K different grades of thermal conductivity to choose from. CVD diamond also has completely isotropic characteristics, strengthening all directions